Technical Briefs and Posters Committee

Conference:5 - 8 December 2016

Exhibition:6 - 8 December 2016

The Venetian Macao, Macao

Technical Briefs and Posters Chair

Johannes Kopf
Facebook
Germany

 

Technical Briefs and Posters Co-Chair

Chi-Wing Fu, Philip
The Chinese University of Hong Kong
Hong Kong

 

Technical Briefs and Posters Committee

Daniel Aliaga
Purdue University
USA

Thomas Auzinger
IST Austria
Austria

Moritz Baecher
Disney Research Zurich
Switzerland

Bedrich Benes
Purdue University
USA

Jiri Bittner
Czech Technical University
Czech Republic

Nicolas Bonneel
CNRS-LIRIS
France

Tamy Boubekeur
Telecom ParisTech
France

Adrien Bousseau
INRIA Sophia-Antipolis
France

Stefan Bruckner
University of Bergen
Norway

Duygu Ceylan
Adobe
USA

Robin Bing-Yu Chen
National Taiwan University
Taiwan

Yiorgos Chrysanthou
University Of Cyprus
Cyprus

Hung-Kuo Chu
National Tsing Hua University
Taiwan

Carsten Dachsbacher
Karlsruhe Institute of Technology
Germany

Bailin Deng
University of Hull
UK

Julie Digne
LIRIS
France

Hongbo Fu
City University of Hong Kong
Hong Kong

Yotam Gingold
George Mason University
USA

Michael Goesele
Technische Universität Darmstadt
Germany

Cindy Grimm
Oregon State University
USA

Gaël Guennebaud
INRIA Bordeaux Sud-Ouest
France

Diego Gutierrez
Universidad de Zaragoza
Spain

Ying He
Nanyang Technological University
Singapore

Pheng-Ann Heng
The Chinese University of Hong Kong
Hong Kong

Hui Huang
Shenzhen University
China

Jin Huang
Zhejiang University
China

Alec Jacobson
University of Toronto
Canada

Jiaya Jia
The Chinese University of Hong Kong
Hong Kong

Oliver van Kaick
Carleton University
Canada

Yu-Kun Lai
Cardiff University
UK

Tong-Yee Lee
National Cheng-Kung University
Taiwan

Yangyan Li
Shandong University
China

Hao Li
University of Southern California
USA

Ligang Liu
University of Science and Technology of China
China

Lin Lu
Shandong University
China

Liangliang Nan
King Abdullah University of Science and Technology (KAUST)
Saudi Arabia

Andy Nealen
NYU Tandon School of Engineering
USA

Boris Neubert
Karlsruhe Institute of Technology
Germany

Junyong Noh
Korea Advanced Institute of Science and Technology
Korea

Victor Ostromoukhov
CNRS/University Claude Bernard Lyon
France

Pieter Peers
College of William & Mary
USA

Tobias Ritschel
University College London
England

Tianjia Shao
Zhejiang University
China

Andrei Sharf
Ben Gurion University
Israel

Takaaki Shiratori
Oculus Research
USA

Peng Song
University of Science and Technology of China
China

Brian Summa
Tulane University
USA

Kalyan Sunkavalli
Adobe
USA

Andrea Tagliasacchi
University of Victoria
Canada

Shigeo Takahashi
University of Aizu
Japan

Marco Tarini
University of Insubria
Italy

Lvdi Wang
Microsoft Research Asia
China

Yu-Shuen Wang
National Chiao-Tung University
Taiwan

Huamin Wang
Ohio State University
USA

Li-Yi Wei
University of Hong Kong
China

Tien-Tsin Wong
The Chinese University of Hong Kong
Hong Kong

Chris Wyman
Nvidia Corporation
USA

Kun Xu
Tsinghua University
China

Kai (Kevin) Xu
National University of Defense Technology (NUDT)
China

Weiwei Xu
Zhejiang University
China

Sai-Kit Yeung
Singapore University of Technology and Design
Singapore

Lap-Fai Yu, Craig
University of Massachusetts Boston
USA

Jianmin Zheng
Nanyang Technological University
Singapore